325 results found for Web Exclusive, displaying items 1 - 20
October 7, 2008
Breakthrough In Skin-Like Optical Sensing Foils
Leuven, Belgium: Building on last year’s rigid-surface development, INTEC reports that it’s produced the first functional optical links embedded in a flexible substrate. INTEC is IMEC’s associated laboratory at Ghent University. With this technique, it becomes possible to make foils that sense changes in pressure. These skin-like foils could be used in applications that have irregular or moving surfaces, such as robots, pliable machinery, or perhaps artificial skin.
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Roger Engelke
October 3, 2008
Collaboration Formed For Green LED Manufacturing
Leuven, Belgium and Osaka, Japan: Growing demand for brighter green LEDs is the driving force behind a joint agreement inked by IMEC and Taiyo Nippon Sanso. The main goal of their pact is to develop manufacturing technology for high-efficiency light-emitting diode (LED) devices.
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Roger Engelke
October 2, 2008
ISDB-T Reception Enhances FlexiTV For TV On A PC
Fleet, U.K.: An enhanced version of the FlexiTV broadcast receiver, developed by Mirics Semiconductor Inc., debuted this week at CEATEC Japan. The receiver uses the same silicon hardware that demonstrated what the company claims was the first software-demodulation-based reception of DVB-T, FM, T-DMB, and DAB (unveiled at Computex this past June). Now ISDB-T reception can be added to the mix, too.
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Roger Engelke
October 2, 2008
LG Opts For Ericsson Mobile Broadband Modules
Stockholm, Sweden and Seoul, Korea: LG Electronics selected Ericsson to provide mobile broadband modules based on high-speed packet access (HSPA). The modules will be used in LG’s next-generation notebooks and netbooks slated for release this year.
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Roger Engelke
July 18, 2008
Reference Board Achieves NorDig Approval
NXP Semiconductors announced that its STB100 T21 reference board is the first full digital terrestrial system-level solution to pass the NorDig 1.0.3 verification test process.
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Paul Whytock
January 24, 2008
Kontron Offers To Buy French Thales Computer
Munich, Germany—Embedded computer systems company, Kontron, has made an undisclosed offer to acquire French Thales Computers SA. This company is 100% owned by the Thales Group.
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Staff
January 24, 2008
MOSFET Exploits Ribbon Technology
Geneva, Switzerland—A power MOSFET developed by STMicroelectronics takes advantage of the company’s ribbon-bonding technology.
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Staff
January 24, 2008
Venice 6 Module To Support Sirius Radio
Watford, England—Frontier Silicon announced at the Consumer Electronics Show in Las Vegas that it will support the Sirius Internet Radio service on its Venice 6 multi-standard receiver module.
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Staff
January 10, 2008
A Model Agreement
Munich, Germany — GenISys and the Fraunhofer Institute of Integrated Systems and Device Technology (IISB) will join forces to develop and license advanced 3D resist modeling techniques for e-beam and proximity lithography.
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Staff
January 10, 2008
New Computers-On-Modules Based On Intel Processors
At the recently staged SPS/IPC/Drives event in Nuremberg, Germany, Kontron unveiled the ETX-PM3, the new generation of Intel Pentium M and Celeron M processor-based computer-on-modules.
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Staff
October 24, 2007
Power Switch, Controller Merge Onto One Chip
The MIC2569YQS is a CableCard 2.0 Power Controller designed for use in CableCard applications. Developed by Micrel, the controller will supply power to CableCard 2.0 cards in CableCard host systems.
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Staff
October 24, 2007
LabVIEW Embedded Platform Widens Its Scope
National Instruments extended the NI LabVIEW 8.5 graphical system design platform to new embedded targets with the release of the NI LabVIEW Embedded Module for ADI Blackfin Processors 2.5 and the LabVIEW Microprocessor SDK (Software Development Kit) 2.5.
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Staff
October 24, 2007
Faster WiMAX Design
Operators of WiMAX networks can look forward to baseband equipment with improvements in range, coverage quality, and operating efficiency.
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Staff
October 24, 2007
PICMG Publishes Master Glossary
The PICMG Master Glossary, which just became available, contains a compilation of the definitions used in PICMG specifications.
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Staff
October 24, 2007
Conference Preview: Power Electronics Technology
More technical content. More exhibits. More teardowns. More of what you need to know to find the right technologies, products, and components to integrate into an ever-evolving array of complex applications.
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Staff
September 27, 2007
Surface-Mount PIR Sensor Saves Space
Thanks to the company’s technology and new pyroelectric ceramic materials, Murata was able to craft a smaller lead-free, surface-mount pyroelectric infrared (PIR) sensor.
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Staff
September 20, 2007
Fast-Track Development Methodology
With its XPath methodology, ChipX gives customers the ability to launch products quickly with a structured ASIC.
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Staff
September 20, 2007
JAE Achieves Auto Standards Approval
Surrey, England: Connector company JAE has been certified by the Japanese Quality Association (JQA) to ISO/TS 16949.
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Staff
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