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Cover Feature

32 results found for Cover Feature, displaying items 1 - 20

 
November 22, 2007
Keeping Troops Out of Harm’s Way, Technically Speaking
 — John Edwards

October 25, 2007
POLYMER ELECTRONICS ARE ON A ROLL
 — Staff

October 25, 2007
CLASS D 100W+ AUDIO POWER AMPS
 — Staff

October 11, 2007
RISE OF MULTIPROCESSING/ MULTITHREADING SHARPENS FOCUS ON INTERRUPTS
 — Staff

September 27, 2007
Go Graphical in Your Product's Design Cycle
 — Staff

September 27, 2007
Cutting Out Reverse Current Conduction
 — Staff

October 11, 2007
SIMPLE SLIC DESIGN REAPS SLICK POWER RESULTS
 — Staff

March 8, 2006
Tech Fest for the Embedded Enthusiast
 — Paul Whytock

March 22, 2006
Bridge Those Network Gaps
 — Stuart Jamieson

May 10, 2006
Tube Talk
 — Paul Whytock

February 8, 2007
Embedded World 2007 Survival Guide
 — Paul Whytock

March 8, 2007
Embedded World 2007 Dazzles the Crowd
 — Paul Whytock

May 10, 2007
PCIM Survival Guide
 — Paul Whytock

May 24, 2007
The Image Makers
 — Patrick Lind

June 7, 2007
Make Sure Clean Means Green
 — Mark Nursall

August 9, 2007
RoHS Starts to Bite
 — Gary Nevison

November 2005
Turning Hot Ideas Into Cool Designs
Thanks to growing component counts, falling board space, and increasing current requirements, effective thermal management has become one of the key challenges facing designers of distributed power architectures in applications ranging from telecommunications base stations to industrial control systems. In particular, a key goal for the designer is to ensure high-efficiency power conversion while achieving a balanced temperature across the PCB. The advent of intermediate bus...  — Carl Blake , et al.

November 2005
What Is DirectFET Technology?
The schematic in Figure 3 shows the construction of International Rectifier's DirectFET source mounted power-MOSFET technology. As the diagram illustrates, the device is based on a power MOSFET die housed in a copper clip assembly. This MOSFET die has solderable area array gate and source electrode connections on its front surface. The rear surface of the die, which forms the MOSFET drain electrode, is connected to the clip using an electrically conductive adhesive. The clip extends over...  — Paul Whytock

October 2005
MEMS Hitting The Curved Ball
Microelectromechanical-system (MEMS) devices are moving into many fields of industry, providing the basis for novel applications of semiconductor technology in fields as diverse as medicine and high-resolution mobile-phone displays. However, designing MEMS devices is not necessarily a straightforward process for these specialists working with the technology. MEMS is an IC-design discipline that currently has little in the way of support from the large EDA tools vendors, which mainly focus...  — Paul Double

September 2005
Power Perspective
Lambda, the UK-based global power-supply specialist was acquired from Invensys by TDK Corporation of Japan in a deal said to be worth around $235 million. The agreement includes Lambda's entire North American and European operations, as well as Invensys' current 58.2% shareholding in Densei Lambda KK. The deal is expected to create the second-largest power-supply manufacturer in the world, with the largest market share in the industrial power sector by some considerable distance,...  — Paul Whytock





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