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LATEST ISSUE: JUNE 25, 2009
Electronic Design Europe Digital Edition
LEDs bring the heat, so thermal management is always a key factor in their design. In our cover story, Altair Engineering's Dr. Armin Veitl offers up a different solution to this problem, namely ceramic heatsinks. Hot Topics takes an in-depth look at infrared sensors for detection, while Technology venture into the world of multicore parallel programming. Continuous-time sigma-delta ADCs have become essential tools in system-level design, which is the focus of Power Design. In addition, our News section highlights an ultra-thin MEMS accelerometer. Paul Whytock editorializes on foundry finances, while Bob Pease ponders "free" amplifiers.

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WHAT'S NEW
Embedded World 2009
View Electronic Design Europe's view coverage of the Embedded World 2009 Exhibition and Conference.

Electronic Design Europe: 12.18.08
Read the online version of Electronic Design Europe.

Back issues of Electronic Design Europe

ED's Video Coverage from electronica 2008
Check out some of the latest news and products that made their mark at electronica 2008. Our videos bring you interviews straight from the show floor.

Top Ten Design Skills For Tough Times
Wall Street is crashing, credit is shrinking, the economy is sinking, and people everywhere are worried about keeping their jobs. On the other hand, electronic designers with unique and in-demand skills are enjoying the luxury of feeling reasonably secure about their current employment status. Many are even planning for a better and brighter future. During these difficult times, that’s a feeling all designers would like to experience.

NEWS
Ultra-Thin Chip Breathes More Flexibility Into Wearable Electronics
Leuven, Belgium: A new 3D integration process will help foster a new level of flexibility in wearable electronics such as health and comfort monitoring. An ultra-thin chip package (UTCP) technology developed by IMEC and Ghent Univ. makes it possible to integrate complete, flexible electronic systems measuring less than 60 µm thick into a conventional low-cost flex substrate.

New Electric Hybrid Bicycle Unveiled
Tokyo, Japan: An electric hybrid bicycle is the latest entry in Sanyo’s eneloop universe (see the figure). The eneloop bike is designed to be, and claimed as, the industry’s first to conform to the newest standards, offering up a “Power-up Mode” assist ratio of up to 1:2, which makes riding the bicycle more comfortable. A new “loop charge function” generates electricity and charges the battery while in use, and a “two-wheel drive system” provides a safer, more stable ride.

Samsung Samples Small 2Gb DDR3 Device
Seoul, Korea: Samsung Electronics is sampling what it claims is the industry's smallest 2Gb double-data-rate (DDR) DDR3 devices. By using 50nm circuit technology, productivity of the devices is said to be 60% higher than DDR2 devices of an equivalent density. The new 2Gb DDR3-based modules, which make it possible to use up to 16Gb RIMMs (registered in-line memory modules), will save over 40% of the power of 1Gb DDR3 memory modules.

EDITORIAL
Touchy Gets More Feely
Haptics technology has been around for some time now. However, what caught my eye recently was the progress it’s made in a variety of applications.




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